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Chip Assembly Machine Product List

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A new standard for outsourcing semiconductor packaging development called "OSRDA."

Flexible contract development that solves customers' "troubles."

We provide total support for special projects that are impossible on existing mass production lines, from the conceptual stage to mass production. OSRDA (Outsourced Semiconductor R&D Assembly) is a business model that distinguishes itself from mere assembly specialists (OSAT). We can handle any process related to implementation, from substrate design, process development, and prototyping to reliability testing, at any stage and from any point. We offer flexible solutions tailored to our customers' preferences, such as multi-variety variable production and the development of special applications. *Please take a look at the materials that explain the specific service flow of OSRDA.

  • 半導体実装開発のアウトソーシング「OSRDA」という新基準2.jpg
  • Contract manufacturing
  • Chip Assembly Machine

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V-chip assembly machine JVA-217

This is an automatic machine that assembles a base plate onto radial-type conductive aluminum solid capacitors to create surface-mounted vertical chip products.

This device automatically performs the processes of aligning the polarity of capacitors supplied to the parts feeder, cutting the leads, flattening, mounting on the base plate, bending the leads, checking the capacitance, final lead cutting, LC charging and inspection, printing the polarity and characters, drying the printed surface, storing a specified number in embossed carrier tape, and winding onto a reel. * The LC charging of this device adopts a continuous charging method suitable for the characteristics of conductive aluminum solid capacitors. (Charging time: 60 seconds)

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  • Chip Assembly Machine

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